I was asking because twice was clearly enormous from my point of view, I think yes 33% is more realistic (possible that's a little too high also, I think it will be more around 20/25%). With a chip of 308mm2 vs 360mm2, you win 14% of area by chip, but per wafer, you'll produce more around 11/12% of dies. For the yield, do we clearly know if Sony deactivate some CUs (seems 4 between 40 CUs) as it is the case for MS with XsX die? (2 dual CUs desactivated, as it is probably the case with the PS5 one) ? With the smaller die size already over 300mm2 and the size difference, XsX die yield should be lower but I don't think the difference will really be very important.